The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 1996
Filed:
Oct. 11, 1994
Applicant:
Inventors:
Hooman Bolandi, Santa Clara, CA (US);
David E Weldon, Los Gatos, CA (US);
Assignee:
Ontrak Systems, Inc., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451385 ; 451398 ;
Abstract
A semi-conductor wafer polishing machine having at least one polishing pad assembly and at least one wafer holder positioned to hold a semi-conductor wafer against the polishing pad assembly includes a joint having two axes of rotation intersecting at a center of rotation. A wafer chuck is supported on the joint adjacent the periphery of the chuck to provide higher material removal rates at the center of the wafer than the periphery of the wafer during polishing.