The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 1996

Filed:

Jan. 03, 1995
Applicant:
Inventor:

Thomas R Cundiff, Puyallup, WA (US);

Assignee:

The Boeing Company, Seattle, WA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428117 ; 428 71 ; 428 73 ; 428 76 ; 428178 ; 4283171 ; 244133 ;
Abstract

A process for making a layered product having a honeycomb core having cells filled with a foam material, the process comprising the steps of: (a) placing a first layer of an uncured, heat-expandable, foamable material on the top side of a central honeycomb core having empty cells, and placing a second layer of an uncured, heat-expandable, foamable material on the bottom side of the central honeycomb core; (b) placing a first layer of an uncured preform material above the first layer of uncured, heat-expandable, foamable material, and placing a second layer of an uncured preform material above the second layer of uncured, heat-expandable, foamable material; (c) placing the charge made by steps (a) and (b) inside a mold and closing the mold; (d) heating the mold to the cure temperature of the heat-expandable, foamable material, and holding the mold at this temperature for sufficient time to expand and cure the heat-expandable, foamable material; (e) reducing the temperature of the mold to the injection temperature of a selected resin transfer molding (RTM) resin system, and injecting the selected resin transfer molding (RTM) resin system into the mold; (f) holding the temperature of the mold at the cure temperature for the resin transfer molding (RTM) resin system for sufficient time to cure the resin system; and, (g) removing the product from the mold after curing is completed.


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