The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 1996

Filed:

May. 14, 1993
Applicant:
Inventors:

Yoshihiro Yokota, Katsuta, JP;

Shotaro Naito, Katsuta, JP;

Toshihiko Suzuki, Katsuta, JP;

Akira Koide, Chiyoda-machi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P / ;
U.S. Cl.
CPC ...
7351433 ; 7351436 ;
Abstract

A semiconductor accelerometer includes a mass portion formed at a center of a silicon plate, a frame portion formed around the circumference of the silicon plate so as to surround the mass portion and a diaphragm portion formed in the silicon plate between the mass portion and the frame portion so as to bridge the mass portion with the frame portion, one of major surfaces of the silicon plate serving as a common continuous major surface for the mass portion, frame portion and diaphragm portion. Piezoresistance elements are formed on the common continuous major surface at the diaphraqm portion and an additional Au film is formed on the common continuous major surface at the mass portion. The additional Au film constitutes in combination with the mass portion a weight which responds to an acceleration acting thereon. The mass of the additional Au film is selected in such a manner that the center of gravity of the weight is located within an area in the mass portion having a depth corresponding to the thickness of the diaphragm portion.


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