The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1996
Filed:
Oct. 25, 1994
Applicant:
Inventors:
Assignee:
Toray Industries, Inc., , US;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
523443 ; 523457 ; 523458 ; 523459 ; 523466 ; 523481 ; 523482 ; 523485 ; 523486 ; 523487 ; 528104 ;
Abstract
A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
Sawamura, Yasushi. (1996). Semiconductor device-encapsulating epoxy resin composition (U.S. Patent No. 5567749). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5567749
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile