The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1996
Filed:
Nov. 03, 1995
Applicant:
Inventor:
Debabrata Gupta, Scottsdale, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437183 ; 22818022 ;
Abstract
A method for forming conductive interconnect bumps, such as solder bumps, on bond pads on a substrate. The method includes conductive discs and a connecting member formed between two adjacent conductive discs. The discs and connecting member are then placed over the bond pads and heat is applied so that the conductive discs and the connecting member combine to form isolated interconnect bumps. A polymer backsheet is used for support.