The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 1996

Filed:

May. 02, 1994
Applicant:
Inventors:

Guillermo L Romero, Phoenix, AZ (US);

Joe L Martinez, Jr, Phoenix, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257718 ; 257723 ; 257725 ;
Abstract

An electronic module (10) for removing heat from a semiconductor die (41) and a method of making the electronic module (10). The electronic module (10) has a baseplate (11) mated with an isolation structure (23). The isolation structure (23) has three portions: a first portion is bonded to the top surface (12) of the baseplate (11), a second portion is bonded to the bottom surface (13) of the baseplate (11), and a third portion is bonded to a side (14) of the baseplate (11). A semiconductor die (41) is bonded to the first portion of the isolation structure (23) and another semiconductor die (41) is bonded to the second portion of the isolation structure (23). The baseplate (11) has a cavity (20) through which a fluid flows and transports heat away from each semiconductor die (41).


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