The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 1996
Filed:
Oct. 26, 1994
Applicant:
Inventors:
Hideo Morimoto, Hirakata, JP;
Kei Aoki, Ikoma, JP;
Takashi Irie, Suita, JP;
Hiroto Yoneda, Shijonawate, JP;
Assignee:
Nippon Paint Co., Ltd., Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ; C08L / ; C08L / ; C08L / ; C08L / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
525259 ; 525 65 ; 525 66 ; 525 74 ; 525101 ; 525103 ; 525108 ; 525111 ; 525112 ; 525113 ; 525118 ; 525170 ; 525255 ; 525256 ; 525261 ; 525438 ; 525440 ; 525444 ; 525445 ; 525446 ; 525452 ; 525454 ; 525455 ; 525458 ; 525476 ; 525477 ; 525478 ; 525479 ; 525529 ; 525532 ; 525187 ; 525404 ;
Abstract
A resin composition curable through a Michael reaction between (a) a component having a plurality of .alpha., .beta.-unsaturated carbonyl groups and (b) a component having a plurality of activated methylene, activated methyne or hydroxyl groups is disclosed. The curing reaction is catalyzed with a quaternary ammonium, quaternary phosphonium or tertiary sulfonium salt in the presence of an epoxy compound independently added to the composition or covalently attacted to either component (a) or component (b).