The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 1996

Filed:

Sep. 13, 1994
Applicant:
Inventors:

Takeshi Hatanaka, Takasago, JP;

Toshiyuki Miyamoto, Takasago, JP;

Toshio Ujihara, Takasago, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
425145 ; 425149 ;
Abstract

A bank quantity adjusting device for an extruder capable of accurately controlling a bank quantity regardless of a difference in composition of a material to be extruded. The bank quantity adjusting device includes a pressure sensor 13 for detecting a bank pressure between an outlet 7 of an extruder body 1 provided with material extruding screws 3 and a roller die 2 provided before the outlet 7, and a control device 15 for controlling one or both of a screw speed and a roller die speed according to a difference between the bank pressure detected by the pressure sensor 13 and a set target pressure. The bank quantity adjusting device further includes bank quantity detector 14 for detecting a bank quantity between the outlet 7 and the roller die 2, and a processor 16 provided in the control device 15 for obtaining a correlation between the bank quantity and the bank pressure from a detection value of the bank quantity detected by the bank quantity detector 14 and a detection value of the bank pressure detected by the pressure sensor 13 upon detection of the bank quantity, converting a target value of the bank quantity into a pressure value by using the correlation obtained above, and setting this pressure value to the above target pressure.


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