The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 1996

Filed:

Sep. 30, 1993
Applicant:
Inventors:

Kenichi Satou, Ikoma, JP;

Makoto Kawai, Neyagawa, JP;

Yoshifumi Nakao, Nara, JP;

Satoshi Masuda, Hirakata, JP;

Koichi Kanematsu, Hirakata, JP;

Setsuo Horimoto, Katano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; G06F / ;
U.S. Cl.
CPC ...
29840 ; 29593 ; 29714 ; 29740 ;
Abstract

An assembly line includes a printing device for printing solder on a land of a circuit board, a mounting device for mounting an electric component at a predetermined position of the solder, and a soldering device for soldering the land to a terminal of the component. A monitored items detecting device detects predetermined to be monitored items of the board and equipment used in the printing, mounting, or soldering devices, and a control device analyzes a condition of the equipment and quality of the board with reference to warning criterion which do not exceed failure criterion, and then dynamically controls the various devices accordingly.


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