The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 1996
Filed:
Nov. 04, 1994
Akio Katsumata, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A memory IC having an SOJ type package is mounted on a metal wiring layer on the surface of the outer layer of a multilevel interconnection board. Protecting portions are formed on the package of the memory IC. The protecting portions contact the surface of the metal wiring layer when the memory IC is mounted on the multilevel level interconnection board. The shape of the projecting portions can be of various types, e.g., circular cylinders or prisms. Heat generated within the memory IC is transmitted to the metal wiring layer through the projecting portions. A first insulating layer has first and second surfaces. Wiring layers are formed on each of the first and second surfaces of the first insulating layer, and first and second semiconductor chips are connected to those wiring layers. First and second resin layers cover the whole surface of the outermost wiring layers and the first and second semiconductor chips.