The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 1996
Filed:
Dec. 19, 1995
Gary L Small, Los Gatos, CA (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
An adapter unit configurable for testing ICs having different power and ground contact configurations is customized for one of such configuration and mounted on a load board having first and second plurality of signal contacts, wherein respective pairs of the first and second plurality of signal contacts are connected to both a contact of the IC and a test channel from an IC tester. The adapter unit is mounted on the load board making contact with the first plurality of signal contacts, while a DUT board holding the IC is mounted on the load board making contact with the second plurality of signal contacts. The adapter unit includes a plurality of signal contacts respectively connected to the first plurality of signal contacts of the load board, a power bus ring connected to a power line provided by the IC tester, and a ground bus ring connected to a ground line from the IC tester. The adapter unit is configured for a specific power and/or ground contact configuration by providing power jumpers connecting each of the signal contacts of the adapter unit connected to power contacts of the IC being tested to the power bus ring while the test channel connected to that signal contact is inactive, and by providing ground jumpers connecting each of the signal contacts of the adapter unit connected to ground contacts of the IC being tested to the ground bus ring while the test channel connected to that signal contact is inactive.