The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 1996
Filed:
Jun. 05, 1995
Applicant:
Inventors:
Noriaki Saito, Tsukuba, JP;
Takashi Morimoto, Tsukuba, JP;
Kazuo Takebe, Tsukuba, JP;
Yutaka Shiomi, Tsukuba, JP;
Shigeki Naitoh, Tokyo, JP;
Shuichi Kanagawa, Tsukuba, JP;
Assignee:
Sumitomo Chemical Company, Limited, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B29C / ; C08G / ; C08L / ;
U.S. Cl.
CPC ...
428 76 ; 428209 ; 525507 ; 528 98 ; 528153 ; 26427217 ;
Abstract
A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.