The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 1996

Filed:

Mar. 13, 1991
Applicant:
Inventors:

Tatsuzi Nakagawa, Kanagawa, JP;

Tatsuo Nishimoto, Fussa, JP;

Assignees:

Aida Engineering, Ltd., Kanagawa, JP;

Hoya Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
425139 ; 425144 ; 425183 ; 425186 ; 425190 ; 425195 ; 425547 ; 425556 ; 425589 ; 425411 ; 425437 ; 425422 ; 425810 ;
Abstract

A mold assembly having at least one mold body with at least one cavity formed therein. The mold includes at least one mold insert coupling portion formed on the mold body; at least one mold insert being of substantially complementary size and shape with respect to the mold insert coupling portion, each insert being provided with a tapered guide surface for guiding the mold insert into the mold insert coupling portion; at least one means for clamping the mold insert in a predetermined position within the mold insert coupling portion. The mold insert is reciprocally movable within the mold insert coupling portion in a direction generally perpendicular to the parting line of the mold assembly.


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