The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 1996

Filed:

Mar. 17, 1995
Applicant:
Inventors:

Christopher H Bajhorek, Los Gatos, CA (US);

Robert E Fontana, San Jose, CA (US);

Clint D Snyder, Monte Sereno, CA (US);

David A Thompson, San Jose, CA (US);

Mason L Williams, San Jose, CA (US);

Celia E Yeack-Scranton, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B / ;
U.S. Cl.
CPC ...
2960312 ; 2960314 ; 2960315 ; 360104 ; 360113 ; 360122 ;
Abstract

An integral combination magnetic transducer and suspension assembly suitable for use in both contact recording and in winchester-type applications. A generally rectangular elongated flat suspension member includes a vertical-type inductive read/write transducer formed integrally with the suspension member and is embedded in one end of the suspension member. The vertical inductive transducer is suitable for vertical recording applications. The transducer vertical magnetic pole tip and magnetic yoke structure are formed at one end of the suspension member with the vertical pole tip extending to and exposed at an air bearing surface formed on the lower surface of a slider-shaped protrusion extending from the lower surface of the end of the suspension member. The integral transducer/suspension assembly can be adapted for either flying above the recording media or for use in continuous contact with the recording media. The air bearing surface is formed on the lower surface of a wear pad. The fabrication of the transducer/suspension assembly is adapted to be performed at the wafer level.


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