The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 1996

Filed:

Feb. 17, 1994
Applicant:
Inventors:

Daryl Inniss, Hillsborough, NJ (US);

Ashish M Vengsarkar, Chatham, NJ (US);

Qian Zhong, Scotch Plains, NJ (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ; C03B / ;
U.S. Cl.
CPC ...
385 11 ; 385 37 ; 385123 ; 385141 ; 385142 ; 65385 ; 65425 ;
Abstract

A method of controlling the polarization properties of a photo-induced device in an optical waveguide and a method of investigating the structure of a light guiding body such as an optical waveguide are disclosed. A device, such as gratings, is written by exposing one side of the optical waveguide to light. The unexposed side is then exposed to an amount of light sufficient to impart the desired birefringence to the written device. The birefringence can be minimized in the written device by exposing the opposite side to light in an amount sufficient to minimize the amount of birefringence. The light guiding body is investigated by cleaving the elongated light guiding body, such as an optical waveguide, to expose its cross-section. The cleaved section is then treated to expose difference between the core and cladding. Treatment may include etching in an acid or base. The cross-section is then profiled with a scanning probe microscope such as an atomic force microscope to investigate the structure of the light guiding body. The difference in refractive index can be determined across the cleaved endface based on differences in the etched depth.


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