Computer cpu heat dissipating and protecting device

Abstract

A heat dissipating and protecting device for computer central processing unit (CPU) mounted on a printed circuit board (PCB) includes a first conduction member directly disposed on the CPU and a second conduction member disposed on the PCB to be in heat conduction connection with the CPU via through holes formed on the PCB between the second conduction member and the CPU with conductive plugs inserted therein to form a heat conduction path between the CPU and the second conduction member. A first convection member having fins formed thereon is heat-conductively secured to the conduction members to remove heat from the conduction member. A second convection member in contact engagement with the conduction members has a large surface area for performing heat convection. An elongated bar made of a compliant, high heat conductivity material has a first end press-fit into a slot formed on the second convection member to releasably secure to the latter. The conduction members have at least one groove formed thereon to allow a second end of the bar to press-fit therein to establish a heat conduction contact engagement between the second convection member and the conduction members. There may be more than one such grooves directed in different orientations, which, in combination with the compliance of the bar, allows the second convection member to be accommodated within a notebook computer.