The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 1996

Filed:

Jan. 17, 1995
Applicant:
Inventors:

Tetsu Tanizawa, Kawasaki, JP;

Hideo Takuda, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437195 ; 437250 ;
Abstract

A semiconductor device includes a first layer, a first interconnection layer formed on the first layer, at least one dummy pad formed on the first layer in a vicinity of the first interconnection layer, a second layer which is made of an insulator material and is formed on the first layer so as to cover the first interconnection layer and the dummy pad, and a second interconnection layer formed on the second layer and electrically coupled to the first interconnection layer via a via hole in the second layer. The dummy pad is provided in a vicinity of the via hole so that the second layer is approximately flat at least in the vicinity of the via hole, and the dummy pad is electrically isolated from the first and second interconnection layers.


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