The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 1996
Filed:
Jul. 05, 1994
Eric M Hubacher, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Probing array bumped semiconductor devices using cantilever probe needles is facilitated by the formation of peripheral test pads. A semiconductor die (10) includes bond pads (12). A redistribution metallization layer is deposited and patterned to form individual redistribution structures (26) associated with and electrically coupled to each bond pad. Each redistribution structure includes a test pad (28), a bump pad (30) and a bump pad interconnect (32). The test pads are formed in positions close to those of the underlying bond pads, while the bump pads can be formed anywhere within the die. Having the test pads located similarly to the bond pads enables the same or a similar probe card apparatus and cantilever needles (50) to probe the die either at the bond pads for devices which are to be wire bonded or TAB bonded, or at the test pads for devices which are to be bumped.