The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 1996

Filed:

Dec. 22, 1994
Applicant:
Inventors:

Hiroaki Takeuchi, Nikko, JP;

Hiroshi Kano, Imaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F / ;
U.S. Cl.
CPC ...
148551 ; 148552 ; 148693 ; 148697 ; 148698 ; 148415 ; 148437 ; 420548 ; 420551 ; 420553 ;
Abstract

The present invention provides a high strength aluminum alloy suitable for use in the manufacture of a fin, said aluminum alloy containing at most 0.1% by weight of Si, 0.10 to 1.0% by weight of Fe, 0.1 to 0.50% by weight of Mn, 0.01 to 0.15% by weight of Ti, and the balance of Al and unavoidable impurities, intermetallic compounds having a diameter not larger than 0.1 .mu.m being distributed within the metal texture of the alloy in a number density of at least 10/.mu.m.sup.3. The present invention also provides a method of manufacturing a high strength aluminum alloy suitable for use in the manufacture of a fin, comprising the steps of heating to 430.degree. to 580.degree. C. an aluminum alloy ingot of the composition noted above, applying a hot rolling treatment to said aluminum alloy ingot to obtain a plate material before the temperature of the aluminum alloy ingot is lowered by at most 50.degree. C. from the temperature immediately after the heating step, applying a cold rolling treatment to the resultant plate material such that the final rate of reduction in the thickness of the plate material is at least 80%, and applying a homogenizing annealing treatment to the cold rolled thin plate material at 250.degree. to 320.degree. C. to cause intermetallic compounds having a diameter not larger than 0.1 .mu.m to be distributed within the metal texture of the alloy in a number density of at least 10/.mu.m.sup.3.


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