The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 1996
Filed:
May. 18, 1995
Adrianus P Van Gaal, Kanata, CA;
Richard J Humphreys, Kanata, CA;
John C Atkinson, Ottawa, CA;
Amit Chawla, Nepean, CA;
Yee-Ning Chan, Nepean, CA;
Northern Telecom Limited, Montreal, CA;
Abstract
Electronic unit in which a printed circuit board is located within a housing which includes a heat sink. The board is normally urged out of heat conductive relationship with the heat sink. As temperature increases the circuit board and heat sink are caused to move relatively so as to bring the board into heat conductive relationship with the heat sink so as to remove heat from the board. As temperature decreases the board and heat sink are again moved out of heat conductive relationship. Preferably a heat conduction element is provided to conduct heat from the board. This comprises at least one compressible member, e.g. compressible cellular material, which is progressively compressed as temperature increases. Preferably the heat conductive efficiency of the compressible member increases as compression increases.