The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 1996
Filed:
Jan. 18, 1994
Applicant:
Inventors:
John T Anderson, Woodside, CA (US);
V K Nagesh, Cupertino, CA (US);
Richard C Ruby, Menlo Park, CA (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ; C04B / ; C04B / ; H01L / ;
U.S. Cl.
CPC ...
505124 ; 505440 ; 505471 ; 505741 ; 505780 ; 505785 ; 505818 ; 505236 ; 505434 ; 252518 ; 252521 ; 427 62 ; 4271265 ; 428403 ; 419 21 ; 419 35 ;
Abstract
A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.