The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 1996

Filed:

Apr. 18, 1995
Applicant:
Inventors:

George A Meyer, IV, Conestoga, PA (US);

Jerome E Toth, Hatboro, PA (US);

Richard W Longsderff, Lancaster, PA (US);

Assignee:

Thermacore, Inc., Lancaster, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D / ;
U.S. Cl.
CPC ...
16510433 ; 257718 ; 361710 ; 361709 ; 361711 ;
Abstract

The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of the heat. One surface of the pad is flat and contacts the circuit chip while the opposite surface of the pad is attached to a simple cylindrical heat pipe. The pad includes extensions from its sides to which a holding fixture applies force so that the pad is held tightly against the chip. The holding fixture is held on the mounting board by screws while the top of the pad which is attached to the heat pipe protrudes through a hole in the holding fixture. A finned heat exchanger is attached to an end of the heat pipe remote from the conductive pad.


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