The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 1996

Filed:

Sep. 13, 1994
Applicant:
Inventors:

Herbert S Cole, Jr, Burnt Hills, NY (US);

Theresa A Sitnik-Nieters, Rexford, NY (US);

Assignee:

Martin Marietta Corporation, King of Prussia, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ; H05K / ;
U.S. Cl.
CPC ...
21912169 ; 437209 ; 437211 ; 437225 ; 29832 ;
Abstract

In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.


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