The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 1996
Filed:
Jul. 20, 1994
Akira Furuzawa, Kokubu, JP;
Akifumi Sata, Kokubu, JP;
Takeshi Kubota, Kokubu, JP;
Kunihide Shikata, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A dielectric ceramic composition having a high dielectric constant and a coefficient of thermal expansion nearly comparable with that of alumina, and a package for packaging semiconductor. The dielectric ceramic composition contains 0.1 to 0.6 parts by weight of manganese reckoned as an oxide per 100 parts by weight of chief components of the formula xTiO.sub.2 .cndot.yMgO.cndot.zSrO or of the formula xTiO.sub.2 .cndot.yMgO.cndot.zCaO wherein x, y and z are numerals that lie within given ranges. The package for packaging semiconductor comprises a package body composed of alumina and having a semiconductor-mounting portion, and a capacitor made up of a dielectric layer and an electrode layer provided on said semiconductor-mounting portion, wherein the dielectric layer is composed of the TiO.sub.2 --MgO--SrO--MnO.sub.2 -type dielectric ceramic or the TiO.sub.2 --MgO--CaO--MnO.sub.2 -type dielectric ceramic.