The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 1996

Filed:

May. 25, 1995
Applicant:
Inventors:

Atsushi Narazaki, Fukuoka, JP;

Yoshiaki Hisamoto, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437 40 ; 437 41 ; 437228 ; 437 50 ; 437 29 ; 437913 ; 5566511 ;
Abstract

In order to prevent an etch-down phenomenon in a gate electrode (106), a source electrode (108) is connected to an upper major surface of a semiconductor substrate (160) through openings (112, 112a) of a protective film (107), while a gate wire (109) is connected to the gate electrode (106) through an opening (111). The opening (112, 112a) are formed by dry etching, whereby the source electrode (108) is reliably insulated from the gate electrode (106). On the other hand, the opening (111) is formed by wet etching, whereby the gate electrode (106) is not etched down. Thus, it is possible to prevent short-circuiting defectiveness across the gate electrode (106) and the semiconductor substrate (160) resulting from an etch-down phenomenon of the gate electrode (106) while guaranteeing electrical insulation between the gate electrode (106) and the source electrode (108).


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