The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 1996
Filed:
Oct. 07, 1994
Steven J Diffenderfer, Deposit, NY (US);
Hussain Shaukatullah, Endwell, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic package including a leadframe that includes a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion surrounding the semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from each other and from the common ground portion, and a plurality of ground leads electrically connected to the common ground portion. A semiconductor chip including a plurality of signal sites and a plurality of ground sites is mounted on the semiconductor chip support of the leadframe. A plurality of electrical connections are provided between selected ones of the signal sites to respective ones of the signal leads and between selected ones of the ground sites to respective ones of the ground leads. A protective enclosure is provided substantially about the semiconductor device, the semiconductor chip support, the common ground portion of the leadframe, and at least a portion of the signal leads.