The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 1996
Filed:
Oct. 12, 1995
Robert T Carson, Lantana, FL (US);
Lisa Reckleben, Boynton Beach, FL (US);
Arnold W Hogrefe, Ft. Lauderdale, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A solder pad for mechanically and electrically coupling solder terminals (420) of electronic devices (410) to a non-conductive ceramic substrate (130) includes a solder pad portion (110) of a conductive runner (120) and a solder wettable layer (210). The solder pad portion (110) of the conductive runner (120) is on the non-conductive ceramic substrate (130). The conductive runner (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad portion (110). The solder wettable layer (210) includes at least 50% indium by weight.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile