The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 1996

Filed:

Feb. 17, 1995
Applicant:
Inventors:

Nobuyuki Nakamura, Nagano-ken, JP;

Masaaki Minamimura, Nagano-ken, JP;

Fumio Shiozawa, Nagano-ken, JP;

Yoshitoshi Yamagiwa, Nagano-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264 405 ; 2643281 ; 425149 ; 425555 ;
Abstract

A method and an apparatus for injection-molding a molten resin wherein any flaw such as warpage, shrinkage or the like does not occur in products having a small thickness when the desired product of injection molded resin is molded by injecting the molten resin into a cavity of an injection molding die. The molten resin is injected into the cavity under proper control with respect to injection speed and pressure, the pressure of the molten resin being temporarily set and reduced to a preset reference value when the cavity is filled with the molten resin, and subsequently, the pressure of the molten resin filled in the cavity is released.


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