The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 1996
Filed:
Sep. 14, 1994
Yoshihisa Maejima, Hamamatsu, JP;
Seiya Nishimura, Hamamatsu, JP;
Masayoshi Takabayashi, Hamamatsu, JP;
Tokuyoshi Ohta, Hamamatsu, JP;
Yamaha Corporation, Hamamatsu, JP;
Abstract
A lead frame for use in producing of a semiconductor integrated circuit comprises a lead frame member, a plurality of leads, a tie bar, a plurality of auxiliary leads, a support-stay portion and a connecting portion. A semiconductor element such as an IC chip is mounted on a semiconductor-element-mounting portion of the lead frame member, while the leads are arranged along and extending from a side portion of the lead frame member. The tie bar is connected among the leads and auxiliary leads at their tip-edge portions. Herein, the auxiliary leads are electrically unconnected from the semiconductor element. Further, the support-stay portion is provided at a corner portion of the lead frame member. The connecting portion is provided between a base-edge portion of the support-stay portion and a base portion of the auxiliary lead. A location of the connecting portion is selected in such a manner than the connecting portion will be unaffected by bending of the leads. In the electroplating of the leads, electric power is certainly applied to the auxiliary lead through the support-stay portion and connecting portion. In order to obtain an uniform thickness of the plated layer formed on the leads, the leads and auxiliary leads are arranged with generally equal spacing therebetween.