The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 1996
Filed:
Jul. 15, 1994
N Deepak Swamy, Austin, TX (US);
Dell USA, L.P., Austin, TX (US);
Abstract
To facilitate the reworking of a multi-tiered circuit board and a laminated multi chip module, a chip module apparatus having a substrate portion is provided. The chip module has first and second opposite sides with vias extending therethrough. Deposited on both sides of the module by conventional processes is a layer of copper. A first mask is applied to the copper layer to expose a copper, electrical circuit pattern. A second mask having holes therein that are offset from the vias is placed over the first mask by conventional processes. Formed on at least one of the chip module's side in the second mask's holes are a spaced series of an solder BGAs, which have melting point temperatures substantially greater than the phase transition temperature of the chip module's substrate portion. The BGA's are formed on the chip module by an electrochemical plating process.