The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 1996
Filed:
Dec. 22, 1993
Applicant:
Inventor:
Shigeru Morita, Fujisawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
1566361 ; 1566451 ; 1566481 ; 1566571 ; 15666111 ; 1566621 ; 437225 ;
Abstract
To planarize the surface of a semiconductor substrate having convex and concave portions as with the case of a trench structure or a multilayer interconnection structure, a burying film is formed all over the surface of the semiconductor substrate to bury the convex portions; a stopper layer is selectively formed on the burying film at the concave portions; and the burying film is removed flatwise by mechanical polishing until the surface of the convex portion is exposed. The method can simply realize a highly precise planarized structure. Further, it is also preferable to form another stopper layer on the surfaces of the convex portions.