The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 1996

Filed:

May. 13, 1994
Applicant:
Inventors:

Garnet E Grant, Port Moody, CA;

Darryl L Rapp, Sugar Hill, GA (US);

Mark G Reifenberger, Norcross, GA (US);

Assignee:

Nordson Corporation, Westlake, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05B / ;
U.S. Cl.
CPC ...
156357 ; 156559 ; 156578 ; 118221 ; 118302 ; 118685 ;
Abstract

An apparatus (12) for use in forming core layers for plywood from a plurality of veneer sections includes a manifold (48) which extends transversely to a work flow path and across which the veneer sections are sequentially moved. An adhesive passage (46) in the manifold (48) is connected in fluid communication with a plurality of modular dispenser guns (44). Each of the modular dispenser guns (44) is connected in fluid communication with either an adhesive dispenser head or a string dispenser head (34). At the adhesive dispenser heads (32), adhesive is engaged by the leading end portion of a veneer section and pressed against the trailing end portion of a next preceding veneer section. At the string dispenser heads (34), string (42) coated with adhesive is applied to downwardly facing major side surfaces of the veneer sections. A plurality of heat conductors (200, 202, and 240) are provided to conduct heat from heaters (96 and 98) in the manifold (48) to the adhesive dispenser heads (32) and the string dispenser heads (34). The heat conductors (200, 202 and 240) have a greater thermal conductivity than the manifold (48). Thus, the heat conductors (200, 202 and 240) may, for example, be formed of copper and the manifold (48) of aluminum.


Find Patent Forward Citations

Grant, Garnet. (1996). Apparatus for forming core layers for plywood (U.S. Patent No. 5540801). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5540801

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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