Relective liquid crystal display including driver devices integrally

Abstract

A silicon dioxide etch stop layer (30) is formed on an inner surface (28b) of a monocrystalline silicon semiconductor layer (28), and a silicon carrier wafer (52) is bonded to the etch stop layer (30). The exposed outer surface (28a) of the layer (28) is uniformly thinned to approximately 4 micrometers. Vertical interconnects or vias (49) are formed through the layer (28), and microelectronic transistor driver devices (42) and storage capacitors (47) are formed on the outer surface (28a) of the layer (28) in connection with the respective vias (49). A substrate (12) is adhered to the outer surface (28a) of the layer (28), and the carrier (52) is removed. Reflective metal back electrodes (20) are formed on the insulating layer (30) in connection with the respective vias (49). A transparent front plate (14) having a transparent front electrode (16) formed thereon is adhered to the insulating layer ( 30) such that a sealed space (24) is defined between the electrodes (16,20) which is filled with liquid crystal material (26). Large scale integrated driver circuitry (38,40) is fabricated in the peripheral portion (28c) of the layer (28) laterally external of the plate (14) and is externally interconnected by via holes (28d,28e) and wirebonds (44,45).