The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 1996
Filed:
Oct. 27, 1994
Applicant:
Inventors:
Michiya Higashi, Kawasaki, JP;
Cao M Thai, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257676 ; 257783 ; 257790 ;
Abstract
A resin-encapsulated semiconductor device having a semiconductor chip mounted on a die pad with a die bonding portion interposed, a lead arranged in a periphery of the die pad and electrically connected with a bonding pad portion of the semiconductor chip, and an encapsulating resin layer which encapsulates the semiconductor chip so that a part of the lead is guided to the outside, wherein an adhesive resin layer is interposed at least either between the die pad and the die bonding portion is described, or between the semiconductor chip and the die bonding portion.