Chassis mounted electromagnetic interference grounding assembly for

Abstract

A spring carrier assembly to attenuate EMI, including an elongated multileaf conductive spring and an elongated carrier. The elongated multileaf conductive spring has a free edge and curved edge. The elongated carrier has a first edge section encompassing the curved edge and a second edge section encompassing the free edge, wherein portions of the conductive spring are exposed and may contact electronic modules in use. The carrier includes a first pivot member formed at a first end of the first edge section of the carrier and second pivot member formed a second end of the first edge section. Spring carriers assemblies may be placed within a housing for receiving electronic modules. Placement of a number of spring carrier assemblies within the housing forms one or more arrays of spring carrier assemblies. An electronic module may be placed within the housing between two arrays of the spring carrier assembly. The spring carrier assemblies pivot or rotate away from the electronic module to allow placement of the module within the housing. Upon insertion of the adjacent electronic module, the spring carrier assembly rotates back into a position parallel to the first electronic module, wherein the conductive springs contact the electronic modules providing EMI grounding.