The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 1996
Filed:
Jun. 07, 1995
Applicant:
Inventor:
Masato Ujiie, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437211 ; 437214 ; 437217 ;
Abstract
A method of manufacturing a semiconductor device which includes providing an insulating substrate with a semiconductor chip mounted on a first face thereof. An insulating package member which is fixed on the first face of the substrate surrounds and houses the semiconductor chip. Various manufacturing steps are described, such as molding, grinding, and machining. In one step, ultrasonic waves are used to drive a grinding head. In another step, a rotating grinding wheel is used to mill out a groove. The method is designed to reduce warpage and improve the flatness of the substrate.