The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 1996

Filed:

Aug. 15, 1994
Applicant:
Inventors:

Nobuaki Kadono, Nagaokakyo, JP;

Kenichirou Kidou, Nagaokakyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156250 ; 156344 ; 437226 ;
Abstract

A component supply method includes the steps of sticking an adhesive sheet, which is provided on its upper surface with a first foam releasable adhesive layer whose adhesion, can be reduced by heating, onto an upper surface of a pallet having a side surface serving as a reference portion, sticking a wafer onto the upper surface of the adhesive sheet, cutting the wafer for obtaining a number of components, reducing the adhesion of the first adhesive layer by heating, and taking out the individual components, obtained by cutting the wafer, from the pallet. In the steps of sticking the adhesive sheet, sticking the wafer and taking out the components, the elements are located on the basis of the side surface of the pallet serving as a reference portion.


Find Patent Forward Citations

Kadono, Nobuaki. (1996). Component supply method (U.S. Patent No. 5534102). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5534102

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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