The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 1996

Filed:

Mar. 04, 1993
Applicant:
Inventors:

Kazutaka Yano, Himeji, JP;

Katsuhiro Kajikawa, Himeji, JP;

Kinya Nagasuna, Himeji, JP;

Yoshio Irie, Himeji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ; C08J / ;
U.S. Cl.
CPC ...
525384 ; 526240 ; 52631841 ; 526320 ; 526 73 ; 528481 ;
Abstract

An absorbent resin exhibiting a high absorption ratio, having only a small water-soluble component content, and have excellent gel stability to withstand the effect of aging is produced. The production of the absorbent resin comprises a step of polymerizing a water-soluble monoethylenically unsaturated monomer by using, in a proportion of 0.01-0.3 mol % based on the amount of the water-soluble monoethylenically unsaturated monomer, a cross-linking agent having at least one group of the following formula I: ##STR1## wherein R.sup.1 is an alkylene group of 2 to 4 carbon atoms interposed between two polymerizing unsaturated groups in the molecular unit thereof and then heat-treating the resin produced by the polymerization at a temperature in the range of from 160.degree. to 230.degree. C.


Find Patent Forward Citations

Yano, Kazutaka. (1996). Method for production of absorbent resin (U.S. Patent No. 5532323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5532323

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