The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 1996
Filed:
Mar. 01, 1995
Jing S Goh, Singapore, SG;
Chee C Lau, Singapore, SG;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A system (30) and method for preheating molding compound in the form of resin pellets (20) used in molding integrated circuits (50). A slanted plate (36) is connected to an electrode (31) to preheat resin pellets (20). The slanted plate (36) produces a temperature gradient in pellets (20) with a high temperature end (21) and a lower temperature end (22). A preheated pellet (20) with the lower temperature end (22) first is placed in a mold pot (40). A transfer ram (46) contacts the high temperature end (21) of the pellet (20) to deform the pellet (20) and fill any void spaces between the pellet (20) and surrounding mold pot bushing (44). The ram (46) continues to deform the pellet (20) to force air or other gases from the mold pot bushing (44) and to inject molding compound into a mold cavity (42).