The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 1996
Filed:
Dec. 23, 1991
Applicant:
Inventor:
Chandler H McIver, Tempe, AZ (US);
Assignee:
GI Corporation, Hatboro, PA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257698 ;
Abstract
A semiconductor package houses a single two terminal semiconductor component. The package is hermetically sealed and is adapted for surface mounting. The package consists of an open ceramic box that has slots for external leads. A glass seal provides the means for sealing the leads to the ceramic box. The semiconductor element is in a die form and one terminal is directly bonded to one of the external leads. The other terminal is bonded to a clip that in turn is bonded to the other lead. A lid is sealed to the top of the ceramic box to provide the hermetic seal.