The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 1996
Filed:
Dec. 09, 1994
Yosuke Miwa, Shimonoseki, JP;
Junichi Ohsako, Shimonoseki, JP;
Motohisa Miyafuji, Shimonoseki, JP;
Isao Hosokawa, Shimonoseki, JP;
Syuhei Mori, Shimonoseki, JP;
Kabushiki Kaisha Kobe Seiko Sho, Kobe, JP;
Abstract
Conductivity distribution on the cross section of metal or alloy is measured by an eddy current type conductivity meter and conductivity distribution contour map is prepared. Based on the pattern of this conductivity distribution contour map, heat history of an ingot and segregation of added element are analyzed and melting and/or casting conditions of metal or alloy are re-established. This method allows to carry out the testing and analysis within short time and quickly provides assessment results for re-establishment of melting and/or casting conditions. Thereby, metal or alloy ingots which may create poor quality products during the following steps can be eliminated; in particular, applying this method to a manufacturing of copper precipitation hardening alloy and the like, more sound ingots can be obtained and suitability of ingots for the material which should be worked in the following step can be assessed.