The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 1996
Filed:
Jun. 20, 1995
Richard J Middlehurst, Fremont, CA (US);
Michael K Knight, Fremont, CA (US);
Berg Technology, Inc., Reno, NV (US);
Abstract
A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board. A metal pattern or ground plane mesh is defined on at least a surface of the substrate, and coated through holes are defined in the substrate at a predetermined distance such that the impedance of at least one signal path is controlled to match the anticipated impedance of the lead. Further, radio-frequency interference with at least one signal path is suppressed.