The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 1996
Filed:
Sep. 25, 1995
Takashi Harada, Hidaka, JP;
Kazuhiro Yoshihara, Ohme, JP;
Kazutaka Masuzawa, Ueda, JP;
Kiyoshi Hayashi, Ohme, JP;
Jun Kumazawa, Ohme, JP;
Kenji Nagai, Iruma, JP;
Masahiko Nishiuma, Ohme, JP;
Chiyoshi Kamada, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi ULSI Engineering Corp., Kodaira, JP;
Abstract
For taking a characteristic impedance matching of signal transmission lines in a package which carries thereon a semiconductor chip with a very high-speed LSI formed thereon, there is provided a semiconductor integrated circuit device wherein one ends of signal transmission lines formed on a main surface of a package substrate are extended up to the position just under pads formed on a main surface of the semiconductor chip and are connected to the pads on the chip electrically through bump electrodes, while opposite ends of the signal transmission lines are extended to the outer peripheral portion of the main surface of the package substrate and outer leads are bonded thereto.