The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 1996
Filed:
May. 05, 1995
Applicant:
Inventor:
Carl Missele, Elgin, IL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437209 ; 437211 ; 437215 ; 437217 ; 437902 ;
Abstract
A controlled collapse chip connection device can be heat sinked in the following manner. A carbon composition heat sink (102) having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the controlled collapse connection chip device (101) is positioned in a proximate location to a fabricated thermal mating area (104) of the controlled collapse chip connection device (101). The carbon composition heat sink (102) is then thermally bonded to the thermal mating area (104) of the controlled collapse connection chip device (101).