The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 1996

Filed:

Jun. 14, 1994
Applicant:
Inventors:

Paul T Wombwell, Melbourn, GB;

Philip D Willis, Bishops Stortford, GB;

Peter B Ludman, Gt Wilbraham, GB;

Assignee:

Ciba-Geigy Corporation, Tarrytown, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29K / ;
U.S. Cl.
CPC ...
2643288 ; 2643289 ; 26432813 ; 26432818 ;
Abstract

The present invention provides a process for the manufacture of a moulded article which comprises introducing a curable epoxy resin composition to a mould which is at a temperature high enough to initiate curing of the resin and supplying further resin under pressure to compensate for shrinkage of the composition, the epoxy resin containing coarse decorative particles therein, wherein the epoxy resin is introduced into the mould through a gap having a length which is 30 to 100% of that dimension of the moulded product being made which is adjacent to the gap and a width which is at least twice the maximum size of the decorative particles.


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Wombwell, Paul. (1996). Process for molding epoxy resins with coarse decorative particles (U.S. Patent No. 5523044). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5523044

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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