The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 1996

Filed:

Nov. 22, 1993
Applicant:
Inventors:

Tsukasa Mizuno, Tokyo, JP;

Hirokazu Miyazaki, Tokyo, JP;

Kazuhiko Umezawa, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F04B / ; B60H / ;
U.S. Cl.
CPC ...
165 40 ; 165 804 ; 16510433 ; 361699 ; 257714 ; 622592 ; 62216 ;
Abstract

In a liquid cooling system for a printed circuit board on which integrated circuit packages are mounted, heat sinks are secured respectively to the packages in heat transfer contact therewith. Nozzles are provided in positions corresponding to the heat sinks. A housing is tightly sealed to the printed circuit board to enclose the packages, heat sinks and nozzles in a cooling chamber. A feed pump pressurizes working liquid cooled by a heat exchanger and supplies the pressurized liquid to the nozzles for ejecting liquid droplets to the heat sinks. A liquid suction pump is connected to an outlet of the housing for draining liquid coolant to the heat exchanger and a vapor suction pump is connected to a second outlet of the housing for sucking vaporized coolant to the heat exchanger. The cooling chamber is maintained at a sub-atmospheric pressure to promote nucleate boiling of the working fluid.


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