The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 1996
Filed:
Dec. 27, 1994
Kazuhiro Tahara, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The molded type semiconductor device has a semiconductor chip mounted and molded on a lead frame. The device includes a stub which has an open end at a portion of the lead frame and which is connected to a ground electrode of the semiconductor chip, and a mold resin which molds the stub together with the semiconductor chip. The stub has a length that is a 1/4 wavelength of a signal wavelength used in the device. The stub is formed in a zigzag form or a spiral form. Due to such stub, the satisfactory grounding is ensured to accomplish a simple molded type structure and to improve circuit characteristics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile