The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 1996
Filed:
Nov. 23, 1994
Tsutomu Aono, Gunma-ken, JP;
Takayoshi Nishi, Gunma-ken, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A surface mount flat package for a semiconductor device includes a number of leads on a lead frame. At least one of the leads is straight with a thick section and a thin section. Part of the thin section is inside a protective medium and part extends outside. A bottom surface of the part extending outside the protective medium serves as a connection terminal for the semiconductor device. Another lead is an island lead that has a bonding island on an upper surface thereof. The island lead has a thick section and a thin section. The bonding island is on the thin section. The thin section is entirely within the protective medium. A bottom surface of the thick section is exposed outside the protective medium to serve as a connection terminal. The bottom surfaces of the thick sections are coplanar with each other and preferably coplanar with a bottom surface of the package.