The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1996
Filed:
Dec. 08, 1992
Peter Fink, Althengstett, DE;
Heinz G Horbach, Gechingen, DE;
International Business Machines Corporation, Armonk, NY (US);
Abstract
The invention is a method for replacing integrated circuit chips directly attached on printed circuit boards, and a board and a replacement card module that may be used to practice the method. As the first step, the electronic component and the surrounding fan-out wiring area on the board is mechanically removed, e.g., by micro-milling, typically leaving a recess in the board. A card module having a replacement electronic component and associated fan-out wiring is attached in the recess of the board by common bonding agents. The card module is designed so that its fan-out wiring matches the removed fan-out wiring, and hence is adapted for attachment to the board wiring. After attaching the card module, the wiring of the board is electrically connected with the wiring of the card module by wire bonding, tape automated bonding or other appropriate solder techniques.