The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 1996
Filed:
Mar. 28, 1994
Applicant:
Inventor:
Gu S Kim, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437182 ; 437212 ; 437216 ; 437217 ; 22818022 ;
Abstract
A process for manufacturing a thin profile semiconductor package by means of TAB (tape automated bonding). A barrier metal layer is formed on bonding pads formed on portions of a chip covered with insulating layers. A photoresist layer is formed on the resultant structure, and patterned so as to expose the barrier metal layer, and then bumps are formed on the barrier metal layer as high as the photoresist layer. The semiconductor package is completed by bonding the bumps and inner lead portions of the TAB tape. The photoresist remains on the completed package as a permanent protective layer.